Request for Proposal for International Private Line (IPL)/MPLS circuits to support the Bank’s 2019 Annual Meeting in Chengdu, Sichuan Province, P.R. China
Item Details:
- Organisation: Inter-American Development Bank
- Reference Number: 18-041
- Published: 25 September 2018
- Deadline: 19 October 2018
- Time zone: Washington D.C. Time
- Street: 1300 New York Avenue, N.W.
- City: Washington
- State: District of Columbia
- Country: United States of America
- Zip/Postal Code: 20577
- Expires: This ad has expired
Item Description:
The Inter-American Development Bank is issuing this Request for Proposal (RFP) to solicit proposals from qualified firms for ONE (1) International Private Line (IPL) or MPLS circuits of 30 Mbps of bandwidth, to connect the Bank 2019 Annual Meeting site in Chengdu, P.R. China, and its Washington, D.C. headquarters in the United State of America.
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