Supply of 3D silicon sensors for the ATLAS Inner Tracker (ITk) pixel detector

Item Description:

CERN intends to place one or several contracts for the supply of 3D silicon sensors for the ATLAS ITk pixel detector that will be installed around 2025 as part of the high luminosity LHC (HL-LHC) upgrade. The area to be covered with the 3D pixel sensors is foreseen to be in the range of 0.54 m2 which corresponds to the innermost layer of the ATLAS ITk pixel detector. Considering yield factors, the corresponding total number of single chip modules to be produced is about 2300 units. 3D sensors will be compatible with the needed level of radiation hardness and the small pitch (50×50 um2) read-out chip. The active thickness of the supply will be 150 um, while the total will be 250 um. Production is expected to start by mid-2019.

Interested firms shall have proven experience in producing radiation tolerant 3D sensors as well as the production capacity to cover a large proportion of the supply as a minimum.

Market Survey scheduled for dispatch:

Fourth quarter 2018

Invitation to Tender scheduled to dispatch:

Second quarter 2019

Contacts and Interest in being contacted:

To express an interest please send an e-mail to procurement.service@cern.ch
Technically: S. Grinstein sgrinstein@ifae.es
Commercially: C. Carayon charles.carayon@cern.ch